Articles from Ventiva

Ventiva®, a leader in solid-state cooling solutions, today announced at Computex 2026 a strategic partnership with ASUS to explore next-generation thermal architectures for compact AI computing systems. Through this collaboration, the companies will evaluate how Ventiva's ionic cooling technology can support future ASUS NUC and Mini-PC designs.

Ventiva®, a leader in thermal solutions, today at CES 2026 unveiled its Zoned Cooling™ reference design, a new architectural approach to thermal management that transforms how heat is managed in electronic devices, from laptops to client-edge devices to data center infrastructure. As AI workloads grow, requiring more compute power, memory, storage, and 24/7 responsiveness, traditional fan-based cooling solutions are reaching their limits. Ventiva’s Zoned Cooling design delivers a modular, spatially efficient, and cost-saving alternative that meets the demands of the AI era.

Ventiva®, the leader in thermal solutions, today announced the appointment of Regan MacPherson as General Counsel and Vice President of Human Resources. In this new role, she will oversee the company’s global legal strategy and corporate governance matters and policies. In addition, she will be responsible for driving strategic HR programs that align Ventiva’s talent strategy with its business and operational objectives.

Ventiva®, the leader in thermal solutions, today announced its ICE9™ thermal management system is being featured in a fan-less Compal laptop concept design at Computex 2025. The 45W TDP (thermal design power) reference design integrates Ventiva’s ICE® technology—which cools electronic devices without moving parts, noise, or vibration—and is suitable for high-performance, AI-enabled laptops.

Ventiva®, the leader in thermal solutions, today announced it will demonstrate a laptop thermal test vehicle (TTV) of its ICE9™ thermal management system, providing up to 100W thermal design power (TDP) for high-performance devices, at Computex 2025.

Ventiva®, the leader in thermal solutions, today announced an enhancement to its ICE9™ thermal management system: intelligent software control. The intelligent system controller enables the ICE9 solution to act as an advanced air quality detector, detecting and defeating dust and airborne contaminants to ensure optimal system performance in laptop computers and other electronic devices.

Ventiva®, the leader in thermal solutions, today announced that its Ventiva ICE9® thermal management suite is being featured in a proof-of-concept laptop design at CES. By collaborating with Dell Technologies and Intel on the PC design, this concept introduces a new level of silent productivity for sub-12mm laptops.

Ventiva®, the leader in thermal solutions, today announced its ICE9® thermal management suite can now cool laptops that operate at up to 40 watts TDP (Thermal Design Power), enabling thinner, faster, and utterly silent computing devices—without the compromises of traditional, fan-based cooling systems. This allows the ICE9 solution to cool the powerful CPUs required for the next generation of feature-rich, AI-enabled, high-performance laptops.

Ventiva®, a leading company in active cooling solutions for electronic devices, is pleased to announce the results of a year-long collaboration with Compal, a global giant in design and manufacturing of computers and smart devices. The development incorporates Ventiva's groundbreaking ICE9™ thermal management platform with Compal’s advanced engineering, industrial design and manufacturing capability. This collaboration marks a significant milestone in the public adoption of a new air movement technology in a mainstream, high-volume laptop computer.

Ventiva®, a leading company in active cooling solutions for electronic devices, today announced its next-generation thermal management solution suite called ICE9™.

Ventiva®, a leading company in active cooling solutions for electronic devices, today announced the successful completion of its $10 million Series C funding round. The investment was obtained from a balanced mix of new money from multiple investment funds along with strong participation from existing investors.