Articles from Samsung Electronics Co., Ltd.

Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology, today announced the comprehensive AI computing technologies it will showcase at NVIDIA GTC 2026 in San Jose, California, scheduled for March 16-19. As the industry’s only semiconductor company offering a total AI solution spanning memory, logic, foundry and advanced packaging, Samsung will exhibit its full suite of products and solutions that enable customers to design and build groundbreaking AI systems. To learn more about Samsung’s AI solutions, please visit the company’s GTC 2026 booth (#1207).

Samsung Electronics America / Samsung Semiconductor, Inc. today announced a $1 million commitment in product donations to support relief and recovery efforts for communities impacted by the devastating wildfires in Los Angeles.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced it has developed the industry’s first 24-gigabit (Gb) GDDR71 DRAM. In addition to the industry’s highest capacity, the GDDR7 features the fastest speed, positioning itself as the optimum solution for next-generation applications. The 24Gb GDDR7 is currently on display at the Samsung Booth (#B9) at 2024 Open Compute Project (OCP) Global Summit in San Jose, Calif.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced it has begun mass producing PM9E1, a PCle 5.0 SSD with the industry’s highest performance and largest capacity. Built on its in-house 5-nanometer (nm)-based controller and eighth-generation V-NAND (V8) technology, the PM9E1 will provide powerful performance and enhanced power efficiency, making it an optimal solution for on-device AI PCs. Key attributes in SSDs, including performance, storage capacity, power efficiency and security, have all been improved compared to its predecessor (PM9A1a).

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND). With industry-leading speeds and enhanced reliability, the new auto SSD, AM9C1 is an optimal solution for on-device AI capabilities in automotive applications.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced it has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND).

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced three new mobile image sensors designed for both main and sub cameras in smartphones: the ISOCELL HP9, the ISOCELL GNJ and the ISOCELL JN5.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today unveiled its latest foundry innovations and outlined its vision for the AI era during Samsung Foundry Forum (SFF) U.S., an annual event held at the company’s Device Solutions America headquarters in San Jose, California.

Today at Memcon 2024, Samsung Electronics, a world leader in advanced semiconductor technology, unveiled the expansion of its Compute Express Link (CXL) memory module portfolio and showcased its latest HBM3E technology, reinforcing leadership in high-performance and high-capacity solutions for AI applications.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced a collaboration to deliver optimized next generation Arm® Cortex™-X CPU developed on Samsung Foundry’s latest Gate-All-Around (GAA) process technology. This initiative is built on years of partnership with millions of devices shipped with Arm CPU intellectual property (IP) on various process nodes offered by Samsung Foundry.

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications — including the cloud, edge devices and automotive vehicles.

In the release issued October 5, 2023, please replace the keynote speaker photo with the accompanying corrected photo.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its latest foundry technology innovations and business strategy at the 7th annual Samsung Foundry Forum (SFF) 2023.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that its latest automotive processor, the Exynos Auto V920, has been selected to power Hyundai Motor Company’s next-generation in-vehicle infotainment (IVI) systems, which are expected to roll out by 2025. This marks Samsung’s first collaboration on automotive semiconductors with Hyundai Motor, a global mobility leader.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, and AMD (NASDAQ: AMD) today announced they have signed a multi-year agreement extension to bring multiple generations of high-performance, ultra-low-power AMD Radeon graphics solutions to an expanded portfolio of Samsung Exynos SoCs. Through the licensing extension, Samsung will bring console-level graphics quality and optimized power consumption to more mobile devices, offering an incredibly immersive and long-lasting gaming experience.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has secured standardized 5G non-terrestrial networks (NTN) modem technology for direct communication between smartphones and satellites, especially in remote areas. Samsung plans to integrate this technology into the company’s Exynos modem solutions, accelerating the commercialization of 5G satellite communications and paving the way for the 6G-driven Internet of Everything (IoE) era.

Samsung Electronics, a world leader in advanced semiconductor technology, and Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced that Samsung’s Foundry business is providing its 5-nanometer (nm) process technology to Ambarella for its newly announced CV3-AD685 automotive AI central domain controller. This collaboration will help transform the next generation of autonomous driving vehicle safety systems by bringing new levels of AI processing performance, power and reliability.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced production readiness of a high-performance PCIe 4.0 NVMe SSD, the PM9C1a. Integrated with a new controller based on Samsung’s cutting-edge 5-nanometer (nm) process and the company’s seventh-generation V-NAND technology, the PM9C1a will provide elevated computing and gaming performance in PCs and laptops.

HONG KONG, Dec 22, 2022 - (ACN Newswire) - Samsung, a worldwide leader in technological innovation, is generating a buzz of excitement in town this winter with a massive outdoor "immersive 3D" new photo hotspot for the holidays! After working with Japanese and Korean teams, Samsung is collaborating with local creative team DL and computer graphics (CG) production house FATface. Together, they will present Impossible Gifting Factory on the ultra-massive Samsung outdoor curved screen that wraps around the facade of Entertainment Building in Central. The visually stunning large-scaled holiday-themed programme is produced with the latest cutting-edge technology. It stars robots performing on the busy street all sorts of electrifying hip-hop break-dancing motion mid-air and handing out virtual presents in their extended arms. This will bring to the busy streets of Central a new immersive visual surprise for the festive season!

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology, as well as the completion of product evaluation for compatibility with AMD.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, and NAVER Corporation, a global internet company with top-notch AI technology, today announced a wide-reaching collaboration to develop semiconductor solutions tailored for hyperscale artificial intelligence (AI) models. Leveraging Samsung’s next-generation memory technologies like computational storage, processing-in-memory (PIM) and processing-near-memory (PNM), as well as Compute Express Link (CXL), the companies intend to pool their hardware and software resources to dramatically accelerate the handling of massive AI workloads.

Samsung Electronics Co., Ltd., a global leader in technology, announced today that 46 of its new products and service innovations have received CES® 2023 Innovation Award honors, including three Best of Innovation Honorees from the Consumer Technology Association (CTA)®. The annual program honors outstanding design and engineering across a multitude of consumer technology product categories.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, as promised at Flash Memory Summit 2022 and Samsung Memory Tech Day 2022, announced today that it has begun mass producing a 1-terabit (Tb) triple-level cell (TLC) eighth-generation Vertical NAND (V-NAND) with the industry’s highest bit density. At 1Tb, the new V-NAND also features the highest storage capacity to date, enabling larger storage space in next-generation enterprise server systems worldwide.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that its latest LPDDR5X DRAM with the industry’s fastest speed of 8.5 gigabits per second (Gbps) was validated for use on Snapdragon® mobile platforms. By optimizing a high-speed signal environment between application processor and memory, Samsung has surpassed the previous maximum speed of 7.5Gbps achieved in March, reaffirming its leadership in the memory market.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today showcased a series of cutting-edge semiconductor solutions set to drive digital transformation through the decade, at Samsung Tech Day 2022. An annual conference since 2017, the event returned to in-person attendance at the Signia by Hilton San Jose hotel after three years.

Samsung Electronics, the world leader in advanced memory technology, today unveiled an array of next-generation memory and storage technologies during Flash Memory Summit 2022, held at the Santa Clara (California) Convention Center, Aug. 2-4. In a keynote titled "Memory Innovations Navigating the Big Data Era," Samsung spotlighted four areas of technological advancement driving the big data market — data movement, data storage, data processing and data management — and revealed its leading-edge memory solutions addressing each field.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully developed a second generation of its pioneering SmartSSD.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun sampling the industry’s first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) DRAM featuring 24-gigabit-per-second (Gbps) processing speeds. Built on Samsung’s third-generation 10-nanometer-class (1z)* process using extreme ultraviolet (EUV) technology, the new memory is designed to significantly advance the graphics performance for next-generation graphics cards (Video Graphics Arrays), laptops and game consoles, as well as artificial intelligence-based applications and high-performance computing (HPC) systems.

Samsung Electronics Co., Ltd., the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced the 200MP ISOCELL HP3, the image sensor with the industry’s smallest 0.56-micrometer (μm)-pixels.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, and Red Hat, Inc., the world’s leading provider of open source solutions, today announced a broad collaboration on software technologies for next-generation memory solutions. The partnership will focus on the development and validation of open source software for existing and emerging memory and storage products, including NVMe SSDs; CXL memory; computational memory/storage (HBM-PIM, Smart SSDs) and fabrics — in building an expansive ecosystem for closely integrated memory hardware and software.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced its development of the industry's first 512-gigabyte (GB) Compute Express Link (CXL) DRAM, taking an important step toward the commercialization of CXL which will enable extremely high memory capacity with low latency in IT systems.

Samsung Electronics Co., Ltd. and Western Digital (Nasdaq: WDC) today announced that they have signed a memorandum of understanding (MOU) for a unique collaboration to standardize and drive broad adoption of next-generation data placement, processing and fabrics (D2PF) storage technologies. The companies will initially focus on aligning their efforts and creating a vigorous ecosystem for Zoned Storage solutions. These steps will enable the industry to focus on countless applications that ultimately create greater value for customers.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced its new fingerprint security IC (integrated circuit) ─ S3B512C ─ with enhanced security features. The new solution is EMVCo and Common Criteria Evaluation Assurance Level (CC EAL) 6+ certified and performs in line with Mastercard’s latest Biometric Evaluation Plan Summary (BEPS) specifications for biometric payment cards.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its new premium mobile processor, the Exynos 2200. The Exynos 2200 is a freshly designed mobile processor with a powerful AMD RDNA 2 architecture based Samsung Xclipse graphics processing unit (GPU). With the most cutting-edge Arm®-based CPU cores available in the market today and an upgraded neural processing unit (NPU), the Exynos 2200 will enable the ultimate mobile phone gaming experience, as well as enhancing the overall experience in social media apps and photography.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its demonstration of the world's first in-memory computing based on MRAM (Magnetoresistive Random Access Memory). The paper on this innovation was published online by Nature on January 12 (GMT), and is set to be published in the upcoming print edition of Nature. Titled ‘A crossbar array of magnetoresistive memory devices for in-memory computing1, this paper showcases Samsung’s leadership in memory technology and its effort to merge memory and system semiconductors for next-generation artificial intelligence (AI) chips.

Samsung Electronics Co., Ltd., a global leader in technology, announced today that 43 of its new product and service innovations received CES® 2022 Innovation Awards honors, including four Best of Innovations accolades, from the Consumer Technology Association (CTA)™. The annual awards program spotlights standout design and engineering across multiple consumer technology product categories.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled an extensive lineup of cutting-edge automotive memory solutions designed for next-generation autonomous electric vehicles. The new lineup includes a 256-gigabyte (GB) PCIe Gen3 NVMe ball grid array (BGA) SSD, 2GB GDDR6 DRAM and 2GB DDR4 DRAM for high-performance infotainment systems, as well as 2GB GDDR6 DRAM and 128GB Universal Flash Storage (UFS) for autonomous driving systems.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced three of its latest automotive chip solutions: the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems, and the ASIL-B certified S2VPS01 power management IC (PMIC) for the Auto V series.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry’s first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry's smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology. Following the company’s shipment of the industry-first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today’s finest, most advanced DRAM process for its DDR5 solutions.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced the first open-source software solution, the Scalable Memory Development Kit (SMDK), that has been specially designed to support the Compute Express Link (CXL) memory platform. In May, Samsung unveiled the industry’s first CXL memory expander that allows memory capacity and bandwidth to scale to levels far exceeding what is possible in today’s server systems. Now, the company’s CXL platform is being extended beyond hardware to offer easy-to-integrate software tools, making CXL memory much more accessible to data center system developers for emerging artificial intelligence (AI), machine learning (ML) and 5G-edge markets.

Samsung today announced the launch of its 12th annual $2 million* Samsung Solve for Tomorrow Contest, which challenges U.S. students in grades 6–12 to use STEM (science, technology, engineering and math) to tackle local issues of national importance in a sustainable way. Now through November 8, 2021, public school teachers across the U.S. can apply** for this year’s program and submit their activity plans that enable students to inspire real-world change to address critical issues in their communities using problem-based learning.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that four of its System LSI products received product carbon footprint label certification from the Carbon Trust, the first of Samsung’s logic chips to do so.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced the ISOCELL HP1, the industry’s first 200-megapixel (MP) image sensor with 0.64μm pixels, and ISOCELL GN5, the first image sensor to adopt all-directional focusing Dual Pixel Pro technology with two photodiodes in a single 1.0μm pixel.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today showcased its latest advancements with processing-in-memory (PIM) technology at Hot Chips 33 — a leading semiconductor conference where the most notable microprocessor and IC innovations are unveiled each year. Samsung’s revelations include the first successful integration of its PIM-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system, and broadened PIM applications to embrace DRAM modules and mobile memory, in accelerating the move toward the convergence of memory and logic.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem and is the first in the industry to be built with an advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node, offering powerful yet efficient performance demanded by next-generation wearable devices.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced ISOCELL Auto 4AC, an automotive image sensor that offers advanced 120-decibel (dB) high dynamic range (HDR) and LED flicker mitigation (LFM) especially for surround-view monitors (SVM) or rear-view cameras (RVC) in high-definition resolution (1280 x 960). The new sensor is Samsung’s first imaging solution optimized for automotive applications.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing its latest smartphone memory solution, the LPDDR5 UFS-based multichip package (uMCP). Samsung’s uMCP integrates the fastest LPDDR5 DRAM with the latest UFS 3.1 NAND flash, delivering flagship-level performance to a much broader range of smartphone users.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced the industry’s first 0.64-micrometer (μm)-pixel image sensor, the 50-megapixel (Mp) Samsung ISOCELL JN1. Equipped with the latest pixel technologies such as enhanced ISOCELL 2.0, Smart-ISO and Double Super PDAF, the JN1 can capture more vivid images on the industry’s smallest 50Mp mobile sensor.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduces its newest radio frequency (RF) technology based on 8-nanometer (nm) process.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it received the industry’s first Triple Standard for carbon, water and waste by Carbon Trust.

Samsung Electronics, the world leader in advanced memory technology, today unveiled its new enterprise solid-state drive (SSD) featuring Zoned Namespace (ZNS) technology — the PM1731a. Leveraging ZNS, the SSD will maximize available user capacity and offer an extended lifespan in storage server, data center and cloud environments.

Samsung Electronics Co., Ltd., a world leader in advanced digital component solutions, today introduced the LM301B EVO, a new mid-power LED package that has been designed to set the pace in light efficacy and color quality for indoor and industrial applications.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the industry’s first integrated power management ICs (PMICs) — S2FPD01, S2FPD02 and S2FPC01, for the fifth-generation double data rate (DDR5) dual in-line memory module (DIMM).

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled the industry’s first memory module supporting the new Compute Express Link (CXL) interconnect standard. Integrated with Samsung’s Double Data Rate 5 (DDR5) technology, this CXL-based module will enable server systems to significantly scale memory capacity and bandwidth, accelerating artificial intelligence (AI) and high-performance computing (HPC) workloads in data centers.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), leading the evolution of chip packaging technology once again.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced its launch of the industry's highest performing 24G SAS (SAS-4) SSD ― the PM1653. Based on the latest SAS interface, the new drive can support twice the speed of the previous 12G SAS-3 generation. The PM1653 is also the industry’s first 24G SAS SSD made with sixth-generation (1xx-layer) V-NAND chips, enabling storage capacities from 800GB to 30.72TB for advanced enterprise server systems.

Samsung Electronics Co., Ltd., a world leader in advanced digital component solutions, today announced PixCell LED, a new automotive LED module optimized for intelligent headlights, such as adaptive driving beam (ADB) systems. ADB headlamps powered by Samsung’s PixCell LEDs will help improve driver visibility and safety to enhance the overall driving experience at night and in poor weather conditions such as fog or heavy rain.

PC OEMs seeking to deliver optimal performance and user experience have a new avenue available to them: the unprecedented data transfer rates of the PCIe Gen4 interface standard, which offers double the bandwidth of its PCIe Gen3 predecessor. To make it easy for those companies to take full advantage of this technology, Samsung Electronics announced today the availability of its PM9A1, the world’s first OEM-qualified PCIe Gen4 NVMe Client SSD.