ChEmpower Introduces Chakra™, the Industry’s First Functional Pad for Abrasive-Free Planarization
Today, ChEmpower, a leader in semiconductor process innovation, announced Chakra™, a family of functional polishing pads, beginning with the Copper Series, designed specifically for abrasive-free Chemical Mechanical Planarization (CMP). Chakra™ is a core component of ChEmpower’s patented planarization technology, enabling the precision, yield, and surface integrity required for next-generation AI chips, High-Bandwidth Memory (HBM), and advanced packaging technologies such as hybrid bonding.
