The Thermal Mismatch Problem Constraining Large-Format AI Chips Has Been Solved: ACCM's Celeritas HM50 & HM001 Address Warpage, Package Bow, and Signal Loss
Advanced Chip and Circuit Materials today announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package bow, solder fatigue, and high-frequency signal loss in large-format AI accelerators and advanced chip packaging architectures. Celeritas HM50 is a negative CTE (-8 PPM/°C) material and Celeritas HM001 is a near-zero CTE material. Used together in a single stackup, they bring board CTE below 10 ppm/°C while simultaneously delivering Tier 9 electrical performance.
Advanced Chip and Circuit Materials Introduces CeleritasSF & CeleritasBU Products for Ultra-High-Speed, Buildup, and UHDI Printed Circuit Boards
Advanced Chip and Circuit Materials Inc. (ACCM), a US-based manufacturer of skew free, ultra-thin copper-clad laminates and dielectric prepreg materials used to fabricate high layer count PTH, Buildup and UHDI multilayer printed circuit boards (PCBs), today announced the introduction of the CeleritasSF and CeleritasBU series of laminates and prepregs, which enable PCIe Gen 6 & 7 and data rates of 224 Gb/s per channel.
